A sensor system is disclosed. The system comprises: a solid substrate having a front side and a back side, a sensing assembly formed on the front side and being configured to provide electrochemical sensing, a plurality of electrical contacts, formed on the back side and being in electrical communication with the sensing assembly via a plurality of interconnects passing through the substrate and extending at least from the front side to the back side, and a mounting member configured for mounting the back side onto a tip of a movable device.
