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貼付材巻回体の包装構造
专利权人:
日東電工株式会社
发明人:
氏家 貴史,鎌田 浩二,石川 達巳,西村 純也
申请号:
JP2012153955
公开号:
JP6129487B2
申请日:
2012.07.09
申请国别(地区):
JP
年份:
2017
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a package structure with a packing material for covering an outer peripheral surface and both side surfaces of a sticking material winding body, with the packing material being unsealed simply and opened outward easily so as to simply take out the sticking material winding body coated with the packing material.SOLUTION: A packing material to constitute a packing structure comprises: a cutoff part made of two first weakening lines that are substantially orthogonal to the circumferential direction of a surface in contact with the outer peripheral surface of a sticking material winding body and reach end edges and a second weakening line that is provided at a position spaced apart from the cutoff part in the circumferential direction and is substantially orthogonal to the circumferential direction of the surface in contact with the outer peripheral surface of the sticking material winding body and reaches the end edges.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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