An implantable lead includes a lead body having a plurality of electrodes disposed on a distal end, a plurality of terminals disposed on a proximal end, and a plurality of conductors, each conductor electrically coupling at least one of the electrodes to at least one of the terminals. At least one of the conductors includes at least one unit having a multi-layer region of overlapping conductor segments. The unit including a first conductor segment extending from a beginning point to a first position, a second conductor segment extending from the first position to a second position, and a third conductor segment extending from the second position to an endpoint. The first position is between the second position and the endpoint. The second position is between the beginning point and the first position. An interlayer material is disposed between the overlapping conductor segments of the at least one multi-layer region.
