Electrically conductive and mechanically supportive materials for biomedical leads

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专利权人:

Jeffrey Hendricks

发明人:

Jeffrey Hendricks,Sarah Richardson-Burns,Amir Tehrani

申请号：

US13044492

公开号：

US08577476B2

申请日:

2011.03.09

申请国别(地区):

US

年份:

2013

代理人:

摘要：

An implantable medical lead connecting to a device header of a medical apparatus and having an electrode, a conductor, and a conductive polymer layer formed on at least a portion of the medical lead. An insulative sheath surrounds the conductive polymer layer for electrical insulation. The conductive polymer layer and insulative sheath maintain mechanical and electrical continuity of the lead in the event of fracture. The conductive polymer layer is composed of conductive polymers and may contain one or more dopants for improving electrical characteristics, mechanical characteristics, and processability.

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