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A BIOCOMPATIBLE,HUMAN IMPLANTABLE APPARATUS AND A METHOD FOR FULLY ENCASING A CIRCUIT WITHIN A HOUSING
专利权人:
发明人:
COLVIN JR. ARTHUR E.,OCONNOR CASEY J.,WALTERS STEVEN J.,LORENZ CARRIE R.
申请号:
IN3307/KOLNP/2006
公开号:
IN262724B
申请日:
2006.11.10
申请国别(地区):
IN
年份:
2014
代理人:
摘要:
A biocompatible, human implantable apparatus (700) and a method for fully encasing a circuit within a housing are disclosed. The apparatus comprises: a circuit (101) and a glass housing (702), a fully enclosed housing (102) within which said glass housing (702) is housed a brick of epoxy (502) within which the circuit (101) is encased, wherein the brick of epoxy (502) containing the circuit (101) is housed within said glass housing (702) and a second optical epoxy disposed between an outer surface of the brick of epoxy (502) and an inner surface of said glass housing (702).
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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