A sensor comprises a microfabricated chip having a surface with one or more cavities formed thereon, the cavities including sensing components, one or more lids, each covering said surface so as to close at least one of said cavities, the lids contacting rims that delimit said cavities on said surface. Electric circuit portions join, each, a respective one of the lids, to allow the lids to be partly dissolved, electrochemically, responsive to being exposed to an electrochemical solution. In addition, masking material portions cover peripheral regions of the lids at the level of the rims, so as to seal the lids and shield such peripheral regions from said electrochemical solution, in operation. Related apparatuses and sensing methods may be provided.
