ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.;DOW GLOBAL TECHNOLOGIES LLC
发明人:
QIAN, BAINIAN,DEGROOT, MARTY
申请号：
FR20150052548
公开号：
FR3019075(B1)
申请日:
2015.03.26
申请国别(地区):
法国
年份:
2018
代理人:
摘要：
A chemical mechanical polishing pad is providing containing a polishing layer having a polishing surface; and, an endpoint detection window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: an isocyanate terminated urethane prepolymer having 2 to 6.5 wt % unreacted NCO groups; and, a curative system, comprising: at least 5 wt % of a difunctional curative; at least 5 wt % of an amine initiated polyol curative having at least one nitrogen atom per molecule and an average of at least three hydroxyl groups per molecule; and, 25 to 90 wt % of a high molecular weight polyol curative having a number average molecular weight, MN, of 2,000 to 100,000 and an average of 3 to 10 hydroxyl groups per molecule. Also provide are methods of making and using the chemical mechanical polishing pad.
