A production process for a microneedle arrangement and a corresponding microneedle arrangement as well as a use for it is disclosed. The process has the following steps: forming an etching mask in grid form, with grid bars with corresponding grid crossing regions and grid openings in between on a substrate carrying out an etching process to form the microneedle arrangement on the substrate using the etching mask and removing the etching mask. The etching mask in grid form has at least some of the grid crossing regions flat reinforcing regions, which extend beyond the grid bars.
