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PRE-MOLDED SUB-ASSEMBLIES FOR IMPLANTABLE MEDICAL LEADS
专利权人:
发明人:
Jeffrey M. Novotny,Jayesh R. Patel,Geetha Sethumadhavan,Ivan J. Talledo,Ryan T. Bauer
申请号:
US14692470
公开号:
US20150306376A1
申请日:
2015.04.21
申请国别(地区):
US
年份:
2015
代理人:
摘要:
Pre-molded cylindrical sub-assemblies for inclusion in an implantable medical lead are described. The pre-molded cylindrical sub-assemblies comprise a cylindrical conductive element formed from a conductive material to define a substantially continuous interior surface and a substantially continuous exterior surface, and an insulative element formed from an insulative material molded onto the interior surface of the cylindrical conductive element. An interior surface of the insulative element defines a lumen of the pre-molded cylindrical sub-assembly configured to receive one or more elongated conductors of the implantable medical lead, and the cylindrical conductive element is configured to be electrically connected to one of the elongated conductors with the elongated conductors within the lumen. The cylindrical conductive element may act as an electrode, e.g., on a distal portion of the lead, or a connector, e.g., on a proximal portion of the lead.
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