An imaging apparatus includes: an optical system configured to collect incident light； an imaging element including a light receiver configured to receive light input from the optical system and perform photoelectric conversion to generate an electrical signal； and an optical system adhesive layer configured to bond the optical system to a principal surface of the imaging element where the light receiver is provided. The optical system adhesive layer is a photosensitive transparent adhesive for which patterning is performed through a photolithography process and which has a function of determining a position of the optical system relative to the light receiver.
