Filling through-holes

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专利权人:

Rohm and Haas Electronic Materials LLC

发明人:

Jayaraju Nagarajan,Barstad Leon R.,Najjar Elie H.

申请号：

US201514872204

公开号：

US10154598(B2)

申请日:

2015.10.01

申请国别(地区):

美国

年份:

2018

代理人:

Piskorski John J.

摘要：

Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/