The invention relates to a semiconductor materials inspection system having a substrate which is thermally coupled to a heat sink. Drive circuitry is provided to supply power to an array of solid-state light emitting devices which are disposed on the surface of the substrate. The system produces a light output power density of at least about 50mW/cm 2 wherein the solid-state light emitting devices are capable of emitting light in the infrared region between about 1050nm and about 2.5 um.
