Novel polyamide-based hot-melt adhesive composition

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专利权人:

Bostik SA

发明人:

Lachhab, Majdouline,Sajot, Nicolas,Brunet, Christille

申请号：

AU2009256511

公开号：

AU2009256511B2

申请日:

2009.06.04

申请国别(地区):

AU

年份:

2013

代理人:

摘要：

1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: - from 51 to 100% of one or more dimers and/or trimers of fatty acids； and - from 0 to 49% of one or more monomers of fatty acids. 2) Use of said composition with a view to manufacturing disposable hygiene articles.

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