The present invention provides embodiments in which induced RF current heating along the length of a medical lead is reduced. Reduction of induced RF current heating in the medical lead is achieved by positioning a conductor about the exterior of an implantable medical device when the device is placed within an MRI environment. In one embodiment, an RF conductor is incorporated within a header assembly for connecting an implantable medical device to at least one conductor lead. The body of the RF conductor is positioned circumferentially around the implantable medical device. In another embodiment, the medical lead is positioned circumferentially around the exterior of the housing of the medical device. A series of clips or a sleeve holds the medical lead or RF conductor in place around the device.
