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Material encapsulation system
专利权人:
John E. Walls
发明人:
John E. Walls,Jeffrey W. Putt,Kenneth E. DeLine
申请号:
US10544586
公开号:
US08834934B2
申请日:
2004.02.11
申请国别(地区):
US
年份:
2014
代理人:
摘要:
A material encapsulation and release system having a first zone (1) containing a first amount of material (2) bound by a first capsule wall (3) and, if desired, a second zone (4) containing a second amount of material (5) bound by a second capsule wall (6), each capsule wall responsive to similar or dissimilar activation means (7) to release the first amount of material (2) in the first zone (1) and the second amount of material (5) in the second zone (4).
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