Samuel Schimpf,Mark McChrystal,Joseph C. Stark, III,Andre Siebenhaar
申请号：
US15286449
公开号：
US20170065755A1
申请日:
2016.10.05
申请国别(地区):
US
年份:
2017
代理人:
摘要：
A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
