An extendable wireless soil measurement apparatus is disclosed, including a top head and a plurality of sensors, wherein the top head being placed on or above the ground and the plurality of sensors being buried under the soil for sensing soil conditions, generating soil data representing the sensed soil conditions, and transmitting generated soil conditions to the top head； the plurality of sensors able to be assembled into a pole and each of the plurality of sensors including a sensor unit for sensing a soil condition； a circuit module connected to the sensor unit for transmitting sensed soil condition to the top head, a sensor housing for housing the sensor unit and the circuit module； and an engaging element for engaging two sensors in a head-to-tail manner for form a pole.
