The invention relates to a biocompatible composite system, an implantable medical device, and a manufacturing method for a biocompatible composite system. The biocompatible composite system comprises a printed multi-layer circuit board and a feedthrough. The circuit board comprises at least one electrically conductive via. The feedthrough comprises an insulating ceramic base material and at least one electrically conductive cermet pathway. The pathway is embedded into the base material to form an electrically conductive and hermetically sealed connection to the via of the circuit board. The feedthrough and the circuit board are integrated into one composite part.
