The present disclosure relates to a microneedle skin care device using sound wave vibration. According to the present disclosure, there is provided a microneedle skin care device including a housing having a predetermined space formed therein, a sound wave module disposed inside the housing to provide sound wave vibration, a microneedle assembly configured to receive vibration of the sound wave module and vibrate in front and rear directions, the microneedle assembly having microneedles disposed at a front end, and a needle tip coupled to the front end of the microneedle assembly and having through-holes through which the microneedles selectively pass through formed corresponding to the microneedles.According to the present disclosure, an amplitude can be constantly maintained by reciprocating the microneedles using sound wave vibration, and pain of skin care treatment can be mitigated when the treatment is performed using the sound wave vibration.
