Orthopedic devices and low temperature shrinking materials used in such devices are described in this application. The low temperature shrinkable materials have a shrink ratio ranging up to about 7:1 at a low temperature ranging from about 100 to about 150° F. Using these lower temperatures to shrink the materials of the orthopedic devices onto the body part of the patient has less risk of injuring the patient than previous materials. The orthopedic devices can contain different sections with higher and lower amounts of the low temperature shrinkable materials. Other embodiments are described.
