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METALLURGICALLY BONDED GOLD POCKET PAD FOR GROUNDING AN EMI FILTER TO A HERMETIC TERMINAL FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE
专利权人:
Greatbatch Ltd.
发明人:
Robert A. Stevenson,Christine A. Frysz,Jason Woods
申请号:
US15943998
公开号:
US20180236244A1
申请日:
2018.04.03
申请国别(地区):
US
年份:
2018
代理人:
摘要:
A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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