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INTERCONNECT FOR IMPLANTABLE MEDICAL DEVICE HEADER
专利权人:
发明人:
Scott A. Spadgenske
申请号:
US15058820
公开号:
US20160181754A1
申请日:
2016.03.02
申请国别(地区):
US
年份:
2016
代理人:
摘要:
A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connect or receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pre-testing prior to assembly onto an implantable medical device.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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