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Schéma de connexion pour l'assemblage orthogonal de microstructures
专利权人:
IMEC VZW;Albert-Ludwigs-Universität Freiburg;Katholieke Universiteit Leuven
发明人:
申请号:
EP08154893.5
公开号:
EP1985579B1
申请日:
2008.04.21
申请国别(地区):
EP
年份:
2018
代理人:
摘要:
In the present invention a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Also connections to external circuitry can be realised. Also microfluidic channels (10) in the microstructures (20) can be connected to external equipment. Also a method to fabricate and assemble the device is provided.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/

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