A non-resistive contact sensor assembly includes an electric field sensor device, a cover, and a biasing structure. The electric field sensor devices has a dry electrode component for receiving an electrical signal from an object of interest by capacitively coupling with the entity. The signal processing component is surrounded or embedded in the cover. The biasing structure is disposed on the outside of the cover and is adapted to press the dry electrode component against a surface of the object interest when biased by an external structure.
