Jason TSENG,Harry WU,Jing-Wen LIAO,Luca TSENG,Lucy TSENG
申请号：
US14681815
公开号：
US20160114180A1
申请日:
2015.04.08
申请国别(地区):
US
年份:
2016
代理人:
摘要：
An ultrathin microchip structure at least includes a flexible base material. The flexible base material includes an installation surface and a printed surface at an upper surface and a lower surface thereof, respectively. The installation surface is provided with one set or multiple sets of integrated circuits. Each of the integrated circuits at least includes a chip and at least one set of transceiver antenna. One or both of the installation surface and the printed surface of the flexible base material is/are applied with a nanometer film layer having characteristics of being waterproof, dustproof, wear resistant, and penetrable by the RF signal, thereby effectively simplifying the present invention as an ultrathin microchip.
