A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.
