Compound, composition comprising the compound and cured product

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专利权人:

Osamu Kohgo;Shunsuke Miyata;Masataka Miyasato;Chidzuru Inami;Hideyuki Ueki;Hiroshi Naruse;Yoshimitsu Tanabe

发明人:

Hiroshi Naruse,Yoshimitsu Tanabe,Osamu Kohgo,Masataka Miyasato,Hideyuki Ueki,Chidzuru Inami,Shunsuke Miyata

申请号：

US13471765

公开号：

US09504632B2

申请日:

2012.05.15

申请国别(地区):

US

年份:

2016

代理人:

摘要：

The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):

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