陶材焼付用Pd-Ag-Au-Cu系合金
- 专利权人:
- 株式会社松風
- 发明人:
- 小倉 英夫,後藤 真一,根來 紀行,吉本 龍一,鳥田 泰弘,堀 弘二
- 申请号：
- JP2007210985
- 公开号：
- JP5191187B2
- 申请日:
- 2007.08.13
- 申请国别(地区):
- JP
- 年份:
- 2013
- 代理人:
- 摘要：
PROBLEM TO BE SOLVED: To provide a noble-metal alloy for porcelain baking for dental casting, which has a low melting point and can enable the use of a gypsum based investment material at casting and has a thermal expansion coefficient lower than 14.9×10
-6 K-1 .SOLUTION: Combined addition of Ga+In or Sn+In is applied to a Pd-Ag-Au-Cu-based alloy to lower the melting point of the alloy and regulate a thermal expansion coefficient to <14.9×10
-6 K-1 .COPYRIGHT: (C)2009,JPO&INPIT
- 来源网站：
- 中国工程科技知识中心
