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Hot Melt Adhesive Containing A Hydrogenated Styrenic Block Copolymer And An Ethylene Vinyl Acetate Copolymer Exhibiting Low Blocking Force
专利权人:
Bostik Inc.
发明人:
Kevin Stafeil,Kathleen M. Farris
申请号:
US14329058
公开号:
US20150017868A1
申请日:
2014.07.11
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A hot melt adhesive composed of an ethylene vinyl acetate copolymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a liquid plasticizer. The preferred ethylene vinyl acetate copolymer has a vinyl acetate content between 8 and 28 percent by weight, and the preferred hydrogenated styrenic block copolymer is a styrene-ethylene-butylene-styrene having about 30% styrene content and essentially no diblock. The hot melt gives excellent peel strength when used as a construction adhesive for disposable nonwoven articles. It can also be formulated to exhibit very low bleed through and blocking characteristics when used on low basis weight nonwoven fabrics.
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中国工程科技知识中心
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http://www.ckcest.cn/home/
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