Kaupp, Klaus,Hettmann, Heinz,Sasse, Daniel,Menzel, Johannes
申请号：
EP15002659.9
公开号：
EP2997812B1
申请日:
2015.09.12
申请国别(地区):
EP
年份:
2017
代理人:
摘要：
The present invention relates to an apparatus for the manufacture of semiconductor devices； comprising a bonding module (1) comprising a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure； and a load lock module (2) connected to the bonding module (1) and configured for wafer transfer to the bonding module (1) and connected to a first vacuum pumping device (5) configured to reduce the pressure in the load lock module (2) below atmospheric pressure.
